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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Researchers from Tsinghua University have summarized the research on ultrafast laser micro nano manufacturing technology, including material processing, surface/interface control, and device manufacturing. The relevant review titled "A Review of Ultrafast Laser Micro/Nano Fabric: Material Processing, Surface/Interface Control, and Device Fabric" was published in Nano Research.Ultra fast laser proc...
Recently, AP Systems, a well-known laser manufacturer in South Korea, established a new AVP equipment division for the advanced packaging field. This business unit will focus on laser equipment required for advanced packaging processes of high bandwidth memory (HBM).AP Systems is a subsidiary of APS Group, mainly focused on the fields of display and semiconductor laser processing equipment. It foc...
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
In 2017, the detection of gravitational waves generated by the merger of binary neutron stars marked a significant breakthrough in physics. These waves reveal important information about the universe, from the origin of short gamma ray bursts to the formation of heavy elements.However, capturing gravitational waves from the merged residue remains a challenge as these waves avoid the detection rang...