- Нет данных
Русский
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Researchers from Tsinghua University have summarized the research on ultrafast laser micro nano manufacturing technology, including material processing, surface/interface control, and device manufacturing. The relevant review titled "A Review of Ultrafast Laser Micro/Nano Fabric: Material Processing, Surface/Interface Control, and Device Fabric" was published in Nano Research.Ultra fast laser proc...
Recently, IPG Photonics, a leading company in the global fiber laser field, announced the official opening of its new office and central technology center in Japan, marking a solid step in the technology giant's strategic deployment in the Asia Pacific region.The opening of this new office not only demonstrates IPG Photonics' high regard for Japan and the entire Asia Pacific market, but also indic...
Topological laser (TL) is an ideal light source for future new optoelectronic integrated chips, designed and manufactured using topological optics principles to obtain robust single-mode lasers. Electrically pumped topology lasers have become a research hotspot due to their small size and ease of integration, but topology lasers based on electrical injection are still in the early stages of resear...
RIKEN's two physicists have achieved extremely short laser pulses with a peak power of 6 terawatts (6 trillion watts) - roughly equivalent to the power generated by 6000 nuclear power plants. This achievement will contribute to the further development of attosecond lasers, for which three researchers were awarded the Nobel Prize in Physics in 2023. This study was published in the journal Nature Ph...
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...