- Нет данных
Русский
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Researchers from the Massachusetts Institute of Technology and the University of Texas at Austin showcased the first chip based resin 3D printer. Their concept verification tool consists of a millimeter sized photon chip that emits a programmable beam of light into resin holes, which solidify into a solid structure when exposed to light.The prototype processor does not have mobile components, but ...
In 2024, the laser industry will still reach new heights, although some predicted concerns have been fulfilled! From beginning to end, the development path of the manufacturing industry has been full of uncertainty, but as time passes and we enter a new year, new technologies continue to emerge like mushrooms after rain.In 2025, practitioners in the laser and manufacturing industries still face ma...
Main author: Yanming Zhang, Wentao Yana*The first unit: National University of SingaporePublished Journal: Acta MaterialiaResearch backgroundIndustry pain point: Although laser powder bed melting (LPBF) technology can manufacture complex components, the lack of consistent product quality is still the core bottleneck restricting its industrial application. Research has shown that up to 35% of proce...
Thermowood has developed a large-scale additive and subtractive material manufacturing equipment, LSAM, and successfully printed tooling molds on site that can be used for aerospace composite material forming, demonstrating its low-cost and rapid response to composite material manufacturing capabilities to the public.As a large-scale component additive manufacturer, Thermowood has developed a near...
Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...