SEI and Matik showcase the latest laser technology at a joint printing exhibition

Alexander Battery Technologies, a leading company in the field of battery manufacturing, recently announced that it has successfully debugged the world's most advanced laser welding machine, an innovative initiative that will greatly drive the company's production process.Alexander Battery Technologies, as a company dedicated to supporting original equipment manufacturers in bringing lithium-ion b...

Multi photon 3D laser printing technology, as a disruptive micro manufacturing technology, is facing two major challenges: speed and material compatibility. However, the latest research has made breakthrough progress, successfully increasing printing speed tenfold while maintaining excellent detail accuracy.In this remarkable study, scientists abandoned the traditional single beam printing method ...

As a core supporting field of modern technology, the optical industry has broad and diversified development prospects, benefiting from the cross drive of multiple emerging technologies. The following is a systematic analysis from the perspectives of technology trends, application areas, challenges, and opportunities: Core driving forces and growth areas1. Optical communication and 5G/6GDemand ex...

Recently, Weiyuan Photon (Shenzhen) Technology Co., Ltd. (hereinafter referred to as "Weiyuan Photon") announced the completion of a B+round of financing, with investors including Yicun Capital, Chenfeng Capital, and Beijing Guoqian Investment. The specific amount has not been disclosed. According to its official website, MicroSource Photonics was founded in November 2018, with the main members...

In today's technology field, Juguang Technology released two highly anticipated high-power semiconductor lasers on December 13th: GS09 and GA03. These two products are leading the innovation wave in the laser industry with their miniaturized design, excellent thermal management capabilities, and extensive customization flexibility.GS09 revolutionizes chip spacing by compressing the width of the st...