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HGTECH Laser's New Product Debuts at the 2025 Munich Shanghai Light Expo

1116
2025-03-07 16:26:05
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New Product for Wafer Testing Probe Card Manufacturing Equipment Project

 


This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. After picking up the probe, posture correction technology is used to ensure that the probe is implanted into the fixture. Probe crystal disk size 8 ", thickness>20 μ m, cutting accuracy<10 μ m, heat affected zone<30 μ m, correction accuracy<2 μ m, implantation accuracy<10 μ m, welding accuracy XY<3 μ m, Z<8μm， Weld the maximum plate of 12 inches.

application area 
Electronic/Electrical/Semiconductor


New intelligent equipment for comprehensive printing and marking


The comprehensive printing and marking intelligent equipment is particularly suitable for the field of shipbuilding. Based on the assembly line method, it uses UV coding technology, combined with full format automatic 2D visual edge finding technology, under the control of MES system, and combined with dedicated control and programming conversion software, to achieve efficient printing of various display elements on steel plates in shipbuilding. The maximum printing width of the equipment is 5.5m, which can meet the printing needs of all steel plates in the shipbuilding process; The printing speed is fast, with a speed of up to 25m/min when used as an offline device. A steel plate with a size of 5.5 * 22m can complete all printing work in 53 seconds, which is more than 90% slower than traditional methods.

application area 
Tool manufacturing/engineering machinery

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