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The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
Researchers from the Massachusetts Institute of Technology and the University of Texas at Austin showcased the first chip based resin 3D printer. Their concept verification tool consists of a millimeter sized photon chip that emits a programmable beam of light into resin holes, which solidify into a solid structure when exposed to light.The prototype processor does not have mobile components, but ...
Recently, DustPhotonics released a single chip 800G-DR8 silicon photonic chip for data center applications, which is an important milestone in practical photonics in data centers. The company claims that its single-chip solution provides high-performance and easy to implement solutions for system architects.DustPhotonics' 800G-DR8 photonic integrated circuit provides a single chip solution for fib...
Thanks to the advent of high performance computing (HPC) for global laser light sources, the optical communications world is on the verge of major change. This revolutionary technology will redefine the way we transmit and receive data, bringing unprecedented speed and efficiency.Optical communication, which uses light to transmit information, has been a cornerstone of our digital world for deca...
Recently, the Xi'an Institute of Optics and Fine Mechanics of the Chinese Academy of Sciences has made significant progress in the field of intelligent spectral environmental perception. Relevant research results have been published in the top journal in the field of environmental science, Environmental Science&Technology (Nature Index, 5-Year IF: 11.7), and have been selected as cover papers....