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With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are also emerging in an endless stream, and the package density is getting higher and higher, which greatly promotes the development of electronic products to multi-function, high performance, high reliability and low cost.So far, through hole technology (THT) and surface mount technolog...
The rapidly developing IoTech enterprise headquartered in Israel will showcase at LOPEC 2024 how its disruptive digital manufacturing continuous laser assisted deposition technology shapes the future of microelectronics and additive manufacturing.Herv é Javice, co-founder and CEO of ioTech, commented, "We are delighted to be attending the LOPEC exhibition for the first time and showcasing ...
Recently, Swiss company Bystronic disclosed its financial performance for the first half of 2024.The financial report shows that the market situation for the Swiss Super 100 in the first half of 2024 remains very tense. Customers in various end markets are unable to fully utilize their production capacity, and operations in all regions are relatively cautious.Despite Swiss supercar actively reduci...
New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...
A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.With the advent of integrated c...