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On February 27th, Hymson and Leister Group successfully signed a strategic acquisition agreement, announcing the wholly-owned acquisition of the laser plastic welding business of Leister Group.On the same day, the two parties held a grand signing ceremony in Switzerland, which was attended by Mr. Zhao Shengyu, Chairman and General Manager of Hymson, Mr. Chen Jiewei, Director and CEO of Hymson, Mr....
Recently, Preco, a leading enterprise in precision laser material processing and laser equipment manufacturing solutions, officially announced a major personnel appointment: Jacob Brunsberg, an outstanding senior manufacturing and technology management expert, has been appointed as its CEO. Mr. Brunsberg is a renowned senior manager in the field of advanced manufacturing and technology, with man...
Recently, a research team from the Korea Institute of Industrial Technology and POSTECH University successfully utilized laser sintering pattern technology to create a deformable micro supercapacitor (MSCs), specifically designed to provide energy storage solutions for soft electronic devices. This breakthrough meets the urgent need for efficient energy storage systems in stretchable devices in...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
The SCALA 3 LiDAR (Laser Detection and Ranging System), the third generation LiDAR scanner from Valeo, won the "Vehicle Technology and Advanced Mobile Mobility" Innovation Award at the 2024 CES Consumer Electronics Exhibition.The first and second generation Fareo LiDARs SCALA 1 and SCALA 2 have achieved autonomous driving in traffic congestion situations. The third-generation LiDAR SCALA 3 has sig...