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Recently, Hu Lili, a research group of the Advanced Laser and Optoelectronic Functional Materials Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, proposed a new scheme based on rare earth ions Dy3+doped quartz glass as a yellow laser material, and the relevant research results were published in the Journal of the American Ceramic Society as "Effect o...
The nanoelectronics research center IMEC from Belgium announced the successful completion of a significant trial: the fabrication of a 110GHz C-band GeSi electro-absorption modulator on a 300mm silicon photonics platform.Achieving a net data rate of 400Gb/s per lane and optimized for compactness, low latency, and high energy efficiency, imec says its modulator “establishes the foundation for next-...
Chip manufacturer GlobalFoundries (GF) has partnered with fiber optic giant Corning to provide co packaged optical (CPO) interconnects for artificial intelligence data centers.The firms say that Corning’s “GlassBridge” technology, a glass-waveguide based edge-coupler compatible with the v-grooves used in GF’s silicon photonics platform, is wanted for high-bandwidth, power-efficient optical links.“...
LaserON, a laser industrial application group at the University of Vigo, is leading a European project that aims to revolutionize the glass recycling process by developing a new technology called glass laser conversion, so that everyone can recycle at home. This group is led by Professor Juan Pou and Professor Rafael Comesa ñ a, and is part of Cintecx, leading EverGlass. Its partners come f...
Recently, HieFo, a leading enterprise in the field of optical communication, officially launched its HCL30 DFB laser chip, designed specifically to meet the stringent requirements of coherent optical transmission. This chip combines efficient optical output power with excellent narrow linewidth performance, providing multiple industry standard wavelength options in the O-band and C-band, bringin...