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Laserline will once again showcase its latest laser systems for joining and deposition welding at this year's Welding & Cutting show in Hall 5. This time the focus is on the world's first blue diode laser with an output power of 4 kW, which is said to have been developed for processing copper components.Its 445 nanometer wavelength is absorbed by copper and copper alloys, which is five t...
New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...
Recently, the International Electrotechnical Commission Electronic Display Technology Committee (IEC TC110) International Standards Conference was held in Qingdao, attracting more than 120 experts, scholars, and technical representatives from around the world, including Japan, South Korea, and the United States. At the IEC TC110 conference, laser display technology has won wide recognition from in...
By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Recently, the IFA2023 Consumer Electronics Show in Berlin, Germany opened, Hisense exhibited "three-color laser projection family bucket" attracted the attention of media and tourists from all over the world.Since Hisense's young fashion brand Vidda launched a series of three-color laser projection, its accumulation based on three-color laser technology is competing globally and has become a...