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On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
Recently, the research team of the Special Glass and Fiber Research Center of the Advanced Laser and Optoelectronic Functional Materials Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, aimed at the demand for in-situ detection of Raman signals, expanded the functions of the laboratory commercial Renishaw Invia confocal micro Raman spectrometer by usi...
Researchers from the Federal Institute of Technology in Zurich and an American startup used slow curing plastic to develop durable and sturdy robots using high-quality materials.The team can now print these complex robots at once and combine soft, elastic, and rigid materials together. This allows for the creation of precision structures and parts with cavities as needed.Inkbit, a derivative compa...
The research teams from the Laser Fusion Research Center of the Chinese Academy of Engineering Physics, the Beijing Institute of Applied Physics and Computational Mathematics, Peking University, and Shenzhen University of Technology reported experimental verification of the driving pressure enhancement and smoothing of hybrid driven inertial confinement fusion on a 100 kJ laser equipment.The relev...
In the vigorous development of contemporary technology, green laser has become a shining star in the field of electronics. Not only because of its excellent performance, but also because it brings infinite imagination and creative inspiration to creators. The use of green laser for PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit Board) shape cutting has opened up a new artistic journ...