- Geen gegevens
Nederlands
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
With the trend of industrial intelligence and precision processing, the demand for laser precision processing in precision 3C industry, machinery and equipment, new energy vehicles and other industries has developed rapidly, making the application of laser processing technology in the industrial field more comprehensive promotion.Due to the inherent nonlinear characteristics between optics and sca...
Recently, French femtosecond pulse and high peak power (PW class) laser manufacturer Amplitude announced that the company has launched a newly designed Satsuma X femtosecond laser, setting a new benchmark for industrial environments.This product was first announced in 2022 and is now available in a brand new design with proven durability and versatility. In pursuit of excellence and customer satis...
Recently, AP Systems, a well-known laser manufacturer in South Korea, established a new AVP equipment division for the advanced packaging field. This business unit will focus on laser equipment required for advanced packaging processes of high bandwidth memory (HBM).AP Systems is a subsidiary of APS Group, mainly focused on the fields of display and semiconductor laser processing equipment. It foc...
On February 7th, at the Wuhan Semiconductor Laser Equipment Industry Innovation Joint Laboratory located in the HGTECH Technology Intelligent Manufacturing Future Industrial Park, Huang Wei, the technical director of the laboratory and the director of HGTECH Technology's semiconductor product line, gestured with his hands to introduce the principle of "glass through-hole technology" to Changjiang ...
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...