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With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are also emerging in an endless stream, and the package density is getting higher and higher, which greatly promotes the development of electronic products to multi-function, high performance, high reliability and low cost.So far, through hole technology (THT) and surface mount technolog...
International researchers led by Philip Walther from the University of Vienna have made significant breakthroughs in the field of quantum technology, successfully demonstrating quantum interference between multiple single photons using a new resource-saving platform. This work, published in Science Advances, represents a significant advancement in the field of quantum computing and paves the way f...
The University of Wolverhampton (UK), along with global 3D printing leaders EOS and AMCM, will collaborate to establish a new Centre of Excellence (AM) for Additive Manufacturing in the UK. This partnership will provide cutting-edge technology from EOS and AMCM, and focus on developing advanced materials and processes for high demand applications in industries such as aerospace, automotive, aerosp...
Scientists are exploring new ways to get around limitations on the lithography machines used to produce microchips. Researchers are using particle accelerators to create new laser sources that could lay the foundation for the future of semiconductor manufacturing.Plans are underway to build a particle accelerator with a circumference between 100 and 150 meters (328 and 492 feet), about the size of...
Original Hal Bowman 9000 Scientific RazorThe 3 kW laser power output on a 45 mm laser spot consolidates the interlocking structure within the EAC-1A powder bed. Source: Jens Kinst, BAMBy using lasers to melt lunar soil into stronger layered materials, it is possible to build paved roads and landing pads on the moon, according to a concept validation study in a scientific report. Although these exp...