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Recently, researchers announced the development of a way to use laser blasting to break down plastic and other material molecules into their smallest parts for future reuse.This method involves placing these materials on a two-dimensional material called transition metal dichalcogenides and then irradiating them with light.This discovery has the potential to improve the way we handle plastics that...
The team from the Photonic Systems Laboratory at the Federal Institute of Technology in Lausanne has developed a chip level laser source that can improve the performance of semiconductor lasers while generating shorter wavelengths.This groundbreaking work, led by Professor Camille Br è s and postdoctoral researcher Marco Clementi from the Federal Institute of Technology in Lausanne, represe...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
On February 7th, at the Wuhan Semiconductor Laser Equipment Industry Innovation Joint Laboratory located in the HGTECH Technology Intelligent Manufacturing Future Industrial Park, Huang Wei, the technical director of the laboratory and the director of HGTECH Technology's semiconductor product line, gestured with his hands to introduce the principle of "glass through-hole technology" to Changjiang ...
Laser Cladding, also known as laser cladding or laser cladding, is a method of adding cladding material to the surface of the substrate and using a high-energy density laser beam to melt it together with the thin layer on the surface of the substrate. It forms a metallurgical bonded additive cladding layer on the surface of the substrate, which can be used for surface strengthening and defect repa...