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A group of network, semiconductor, and optical companies formed the LPO MSA to develop the network equipment and optical module specifications required to implement a wide ecosystem of interoperable LPO solutions.These specifications address the industry challenges of reducing power consumption, cost, and latency while improving the reliability of high-speed optical interconnections.Accelink, AMD...
On August 6th local time, Luminar, a leading publicly traded company in the field of LiDAR, announced a $422 million debt restructuring and raised $100 million in new capital. This measure marks Luminar taking solid steps in optimizing its capital structure and enhancing its financial stability.In early May this year, this laser radar manufacturer released an open letter disclosing a major strateg...
Recently, Murata Machinery USA, a representative Japanese manufacturer of machinery and CNC machine tools, announced the launch of the latest cutting-edge punch and fiber laser integrated equipment - MF3048HL. This integrated machine combines the advantages of punch operation and laser cutting technology, eliminating the need for separate settings or material transfer between machines.Muratec's pu...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. According to DIT, the equipment supplied to SK Hynix this time is mainly a laser annealing kit. DIT was founded in 2005 and was listed on KOSDAQ in 2018. Its main focus is o...
In the era of speed and precision, the field of thin and medium plate processing is experiencing a revolutionary transformation. Today, let's explore a remarkably fast tool -- BWT’s Lightning 3000W@34μm fiber laser, and witness its impressive performance.On busy production lines, this product is completing complex cutting tasks at astonishing speeds. Its high-speed, high-efficiency, and high-quali...