한국어

Three core processes of laser soldering support the development of PCB electronics industry

203
2024-04-15 16:43:52
번역 보기

In the field of modern electronic manufacturing, PCB (printed circuit board) serves as the carrier of electronic components. In its manufacturing process, laser soldering technology has become a key link in PCB electronic manufacturing due to its advantages of high precision, high efficiency, and low thermal impact. This article will explore the application of laser soldering technology and its main soldering materials - tin wire, solder paste, and solder balls - in PCB electronic manufacturing.

01
Laser Tin Wire Welding for PCB Circuit Board Welding
Tin wire plays an important role in laser soldering process. After focusing the laser beam, it can quickly melt the tin wire, achieving reliable connection between components and PCB boards. This welding method not only reduces the thermal stress generated during the welding process, but also effectively improves the welding quality and reduces the welding defect rate.
Laser tin wire welding has the advantages of high precision and high efficiency, and is suitable for situations with high requirements for welding quality. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved.

02
Laser solder paste welding for PCB circuit board welding
Solder paste is mainly used for soldering surface mount components. After coating an appropriate amount of solder paste on the PCB board, the components are heated by a laser soldering machine to melt the solder paste and penetrate into the gap between the components and the PCB board, forming a solid solder joint.
Solder paste welding has the characteristics of simple operation and fast welding speed, making it suitable for efficient welding on large-scale production lines. In addition, solder paste welding can also reduce production costs and improve welding quality.

03
Laser solder ball welding for PCB circuit board welding
Tin balls, as a new type of soldering material, have received widespread attention in the field of laser soldering in recent years. The laser beam quickly melts the solder balls and accurately drips them onto the solder joints, achieving the welding between the components and the PCB board.
Tin ball welding has the advantages of high welding accuracy and low heat impact, making it particularly suitable for high-end electronic products that require high welding quality, such as BGA chips, wafers, hard disk heads, camera modules, and optoelectronic products.

04
The Future Development of Laser Soldering Technology
In the field of PCB electronic manufacturing, the emergence of laser soldering technology, combined with perfect soldering materials such as tin wire, solder paste, and solder balls, has brought revolutionary changes to the entire electronics industry and injected a continuous stream of vitality. In the future, with the continuous development of technology, we believe that laser soldering technology will play a more important role in the electronics industry, bringing more convenience and surprises to our lives.

05
The advantages of laser soldering technology
The perfect combination of laser soldering technology and various soldering materials further improves the welding quality. Not only has it subverted traditional soldering methods, but it has also significantly reduced production costs and defect rates while improving welding efficiency and quality, laying a solid foundation for the sustainable development of the electronic manufacturing industry.

Soldering materials such as tin wire, solder paste, and solder balls, under the action of laser, can not only quickly melt and achieve perfect fusion with the parts to be welded, ensuring the strength and stability of the welded joint, but also avoiding adverse phenomena such as virtual soldering and cold soldering that may occur in traditional soldering. The high-speed characteristics of laser welding significantly improve production efficiency, providing strong support for the large-scale production of electronic products.

In addition, laser soldering technology also has high flexibility. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved. This flexibility makes laser soldering technology more widely used in the field of PCB electronics, meeting the needs of different customers.

Source: Zichen Laser

관련 추천
  • Zeiss, a century old optical giant, has established the Optoelectronic Optics Division

    Recently, Carl Zeiss announced on its official website that it plans to launch a new strategic business unit, ZEISS Photonics&Optics, on October 1, 2024, with the aim of providing excellent optoelectronic and optical products and solutions to global customers. It is reported that starting from the 2024/25 fiscal year, Zeiss Group will establish a new business unit focused on optoelectronics...

    2024-05-28
    번역 보기
  • JMP: Small hole mode swing laser welding of nickel based high-temperature alloys - simulation, experiment, and process diagram

    IntroductionThe small hole mode swing laser welding has gained increasing recognition due to its ability to bridge gaps, refine microstructures, and enhance the mechanical properties of welds. However, the effects of amplitude, frequency, welding speed, laser beam power, and beam radius on heat flux distribution, melting mode, and three-dimensional temperature field have not been well understood. ...

    04-11
    번역 보기
  • Scientists develop flat-topped laser beams to overcome Gaussian distribution limitations

    The beam emitted by almost all laser systems follows the Angle pattern of Gaussian distribution. The Gaussian irradiance distribution means that irradiance has a smooth peak at the center point and slowly declines toward the edge. In theory, the irradiance level of a Gaussian distribution can never reach zero, which means that the distribution can expand indefinitely. This phenomenon in the laser ...

    2023-08-04
    번역 보기
  • Tsinghua University makes progress in the field of pre sensing optical computing

    In the era of the Internet of Things, visual image sensors, as key devices in the intelligent society, are embedded in various devices such as mobile communication terminals, smart wearable devices, automobiles, and industrial machines. With the continuous expansion of applications, higher requirements have been put forward for the system power consumption, response speed, safety performance, and ...

    2024-08-05
    번역 보기
  • The University of California has developed a pioneering chip that can simultaneously carry lasers and photonic waveguides

    A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.With the advent of integrated c...

    2023-08-10
    번역 보기