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Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consu...
Laser solder paste is a new type of high-tech laser soldering material that is widely used. Laser solder paste achieves high-precision control of circuit board soldering through laser heating in the electronic manufacturing process. This article will provide a detailed introduction to the working principle of laser solder paste and its applications in fields such as electronic manufacturing and au...
Recently, BYD Semiconductor Division held discussions and exchanges with Huagong Technology High Tech Company and Laser Company, opening a new chapter of strategic cooperation.Chen Gang, General Manager of BYD Semiconductor Division, Nie Bo, Party Committee Member and General Manager of Huagong High Tech, Wang Jiangang, Party Committee Member, Deputy General Manager of Huagong Laser, and General M...
Recently, according to a paper published in Nature Communications titled "Phonoenhanced nonlinearities in hexagonal boron nitride," engineers from Columbia University collaborated with theoretical experts from the Max Planck Institute of Material Structure and Dynamics to discover that pairing lasers with lattice vibrations can improve the nonlinear optical properties of layered two-dimensional ma...
At the UpakExpo 2024 exhibition to be held in Moscow at the end of January, Chinese company Golden Laser will showcase for the first time two laser die-cutting machines focused on the printing, labeling, and packaging markets in Russia.The Golden Laser LC350 is a web machine designed to handle labels printed on digital and flexographic printing machines. It can cut, die cut, and kiss cut paper, pl...