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New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...
Aerotech has upgraded the performance of AGV laser scanning heads through powerful controller functions to enhance scanner control (ESC). The new ESC function of the Automation 1-GL4 2-axis laser scanning head driver is a completely passive control loop enhancement function that ensures higher accuracy in the most dynamic motion.With the increasing demand for higher output laser technology in vari...
NUBURU, the leading innovator of high-power and high brightness industrial blue laser technology, announced today that it has been awarded a second phase contract worth $850000 by the National Aeronautics and Space Administration (NASA) to advance blue laser power transmission technology as a unique solution that significantly reduces the size and weight of equipment required for lunar and Martian...
The Mitsubishi GX-F Advanced series of artificial intelligence enabled fiber lasers now use patented gas and burr reduction technology to help improve cutting quality while reducing gas consumption when cutting low-carbon steel.Mitsubishi Laser's proprietary Agr Mix nozzle technology does not require an external mixing tank or high-pressure oxygen. The combination of low-pressure air and nitrogen ...
Sivers Optics, a subsidiary of Sivers Semiconductors, has signed a product development agreement with an undisclosed company.Starting from the initial contract worth $1.3 million, the prototype will be delivered in 2024, and it is expected that the agreement will grow rapidly in 2025 before transitioning to mass production. After entering full production, customers expect the annual chip productio...