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A new automated method for spectral background estimation in laser spectroscopy ensures the accuracy of quantitative analysis with minimal human intervention.When using laser-induced breakdown spectroscopy in spectral analysis, scientists may encounter various obstacles. The most common challenge faced by scientists when conducting elemental analysis is to optimize the interaction between the lase...
The team from the Photonic Systems Laboratory at the Federal Institute of Technology in Lausanne has developed a chip level laser source that can improve the performance of semiconductor lasers while generating shorter wavelengths.This groundbreaking work, led by Professor Camille Br è s and postdoctoral researcher Marco Clementi from the Federal Institute of Technology in Lausanne, represe...
The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....
The Chinese Academy of Sciences reduced the volume of the deep ultraviolet laser by 90% and achieved 193 nm vortex beam output for the first time. Professor Xuan Hongwen described "loading truck equipment into the car trunk". This technology enables a 30% reduction in the size of lithography features, breaking through the bottleneck of the 2-nanometer process. In the next three years, laser power ...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. After the announcement, DIT's stock price rose for five consecutive days, entering the 16000 Korean won range. Then on the 22nd, it rose 2580 Korean won from the previous day'...