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On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
A research team in Japan has designed a flexible and shapable X-ray reflector, achieving significant accuracy and higher stability at the atomic level.This new technology, developed by Satoshi Matsuyama and Takato Inoue from the Graduate School of Engineering at Nagoya University, in collaboration with the Japanese Institute of Physical and Chemical Research and JTEC Corporation, improves the perf...
Creating new laser systems for use in spectroscopy applications is a challenging and costly endeavor. In order to give even small and medium-sized enterprises access to such innovative technology, the Fraunhofer Institute for Reliability and Microintegration (IZM) co-launched the QuantumCascade project to develop a modular laser system for a range of multispectral analytics.This week the IZM repor...
Through joint research, a team developed a 4-amino-TEMPO derivative with photocatalytic performance and successfully used it to produce high-performance and stable fiber like dye sensitized solar cells (FDSSCs) and fiber like organic light-emitting diodes (FOLEDs). This paper was published in the journal Materials and Energy Today.The developed 4-amino-TEMPO derivatives have the characteristic of ...
Laser cutting is a type of metal processing. In industry, there are three main cutting methods: mechanical cutting, thermal cutting, and a set of high-precision cutting methods. Laser technology belongs to the third category. The cutting in this method occurs due to the influence of the laser beam on the product. In fact, it is the molten metal produced by rapid pulse point melting and then blowin...