Tower and Fortsense have announced the launch of their highly advanced 3D imager for LiDAR

Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consumer, and industrial markets. 

According to Yole Group's data, the 3D imaging, sensor, and system market is expected to grow at a compound annual growth rate of 13% to reach $170 by 2028.

Tower's advanced 65nm Stacked BSI CIS platform enables a unique pixel-level hybrid bonding between SPAD arrays and high-performance logic, enabling strategic advantages including high-speed on-chip data processing and small chip size, both essential for high-resolution dToF sensors.

These capabilities, combined with Tower's extensive capabilities in pixel design and customization, have made possible the development of a new family of Fortsense products for applications that require sufficient range measurement and depth mapping to enable fast camera autofocus, 3D scanning, and liDAR.

Michael Mo, CEO of Fortsense, said: "We selected Tower as our strategic partner to develop 3D imager dToF products based on their versatile and skilled CIS platform offerings. The collaboration of the expert teams of both companies, coupled with Tower's extensive experience in the field of imaging, has resulted in several successful developments over the past few years.

We are excited to expand our collaboration to bring new, advanced 3D sensing technologies to market." Solutions that address the growing needs of strategic markets."

Avi Strum, PhD, Senior vice President and General Manager of Tower Semiconductor's Sensor and Display Business unit, said: "Partnering with Fortsense to develop an optimized 3D imager based on dToF sensor technology demonstrates both parties' commitment to driving innovation and delivering superior sensors to the 3D imaging market. We look forward to continuing to work together to develop additional products in this family to deliver advanced solutions that drive mutual growth and success."

Source: Sohu