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According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
Recently, Pentium Laser and Shenzhen Chuangxin Laser launched the world's first 85000W laser cutting machine, once again breaking the record for the highest power in the cutting field.Zhang Qingmao, Director of the Laser Processing Committee of the Chinese Optical Society, Xu Xia, rotating CEO of Pentium Group, Cai Liang, Director of the Final Inspection Department of Pentium Laser Manufactu...
TRUMPF introduced its TruMatic 5000 manufacturing unit and new SheetMaster automatic loading and unloading device technology at the 2023 Blechexpo Metal Plate Processing Exhibition in Stuttgart, Germany.Users of the new system will benefit from fully automatic laser cutting, punching, and forming capabilities. The new SheetMaster device can achieve fully automated material flow within the manufact...
Modern computer chips can construct nanoscale structures. So far, only these tiny structures can be formed on top of silicon chips, but now a new technology can create nanoscale structures in a layer beneath the surface. The inventor of this method stated that it has broad application prospects in the fields of photonics and electronics, and one day, people can manufacture 3D structures on the ent...
The foundation of offshore wind turbines, port protection systems, steel sheet piles, river barriers, water gates, and even pipelines can all be directly processed in water. Another application area is the dismantling of abandoned nuclear reactors, in which case laser technology can gently dismantle steel structures underwater while minimizing the dissolution of radioactive materials.The ocean, wh...