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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
On August 8, local time, Jalisco, Mexico welcomed the grand opening of Yangtze Optics Mexico Cable S.A. de C.V., marking the eighth overseas production base of Yangtze Optical Fiber & Cable Co. ("Yangtze Fiber Optics") has successfully set up its eighth overseas production base in its 36-year development history, further advancing its internationalization strategy blueprint. Today, we are pr...
EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...
On August 19th, local time, LIS Technologies, a U.S.-based developer of laser uranium enrichment technology, announced the latest closing of an $11.88 million seed round of financing. According to reports, LIS Technologies is a company focused on developing advanced laser technology and is the only U.S.-based laser uranium enrichment company to hold a homegrown patent. The round attracted a numb...
Earlier this month, before the annual Intergeo conference held in Germany, Topcon Positioning Systems announced the latest member of its robot total station series. This California based company launched the LN-50 3D laser in early October, marking their latest layout navigator, which has a range of 50 meters.They pointed out that this latest scanner is specifically designed for homebuilders, mech...