Sivers will develop laser arrays for artificial intelligence and deliver prototypes in 2024

On October 15th, the Laipu Technology National Headquarters and Integrated Circuit Equipment R&D and Manufacturing Base project successfully held a groundbreaking ceremony in the Chengdu High tech Zone.Project Business CardTotal project investment:1.66 billion yuanProject area:Covering an area of 39 acres, with a construction area of 65000 square metersProject Planning:Construction will begin...

Recently, the research team of the High Power Laser Element Technology and Engineering Department of the Shanghai Institute of Optics and Mechanics, Chinese Academy of Sciences, has made new progress in the study of improving the damage threshold of fused quartz elements through laser cleaning. The study proposes for the first time the use of microsecond pulse CO2 laser cleaning to enhance the dam...

The optical properties of afterglow luminescent particles in mechanical luminescence and mechanical quenching have attracted much attention in various technological applications. A group of researchers from Pohang University of Science and Technology has attracted attention by developing an optical display technology with ALP that can write and erase messages underwater.The team is composed of Pro...

Scientists from the Hanover Laser Center (LZH) in Germany are studying two laser based processes for producing load adapted hybrid solid components.From a transaction perspective, mixing semi-finished products can help save materials and production costs, but if the components that need to be replaced are made of expensive materials, these materials need to meet high requirements in future use, su...

The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....