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Researchers from Opole University of Technology in Poland have reported the latest progress in studying the effect of post-processing methods on the fatigue performance of materials prepared by selective laser melting (SLM). The related research was published in The International Journal of Advanced Manufacturing Technology under the title "Influence of post processing methods on fatigue performan...
Researchers at the University of Bristol have made significant breakthroughs in expanding quantum technology by integrating the world's smallest quantum photodetector onto silicon chips. The paper "A Bi CMOS Electron Photon Integrated Circuit Quantum Photodetector" was published in Science Advances.In the 1960s, scientists and engineers were able to miniaturize transistors onto inexpensive microch...
Researchers at the University of Sydney combined photon filters and modulators on a single chip, enabling them to accurately detect signals on the broadband RF spectrum. This work brings photonic chips closer to one day, potentially replacing larger and more complex electronic RF chips in fiber optic networks.The Sydney team utilized stimulated Brillouin scattering technology, which involves conve...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
Modern computer chips can construct nanoscale structures. So far, only these tiny structures can be formed on top of silicon chips, but now a new technology can create nanoscale structures in a layer beneath the surface. The inventor of this method stated that it has broad application prospects in the fields of photonics and electronics, and one day, people can manufacture 3D structures on the ent...