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The R&D team of Xi'an Lixin Optoelectronics Technology Co., Ltd. (hereinafter referred to as "Lixin Optoelectronics") has made significant progress in 808nm high-power semiconductor laser chips through continuous technological breakthroughs.808nm semiconductor laser, as an ideal and efficient solid-state laser pump source, plays an important role in advanced manufacturing, mechanical processin...
Researchers from the Hanover Laser Center and Leibniz University in Germany reported on the mechanism of increased welding depth during time power modulation in high-power laser beam welding. The related paper titled "Mechanisms of Increasing Welding Depth during Temporary Power Modulation in High Power Laser Beam Welding" was published in Advanced Engineering Materials.Understanding the basic mec...
According to the University of Cambridge, researchers have developed a new method for 3D printing metal, which can help reduce costs and more effectively utilize resources. This method, developed by a research team led by the University of Cambridge, allows structural modifications to be "programmed" into metal alloys during 3D printing - fine-tuning their performance without the need for thousand...
Recently, TSMC held a groundbreaking ceremony for its first European 12 inch wafer fab. It is reported that the European Union has approved Germany to provide 5 billion euros in subsidies for the factory.It is understood that TSMC's 12 inch wafer fab is located in Dresden, Germany and is called "European Semiconductor Manufacturing Company (ESMC)". In August 2023, TSMC announced a partnership with...
An international team of scientists is rethinking the fundamental principles of radiation physics, aiming to create ultra bright light sources. In a new study published in Nature Photonics, researchers from the Higher Institute of Technology in Lisbon, Portugal, the University of Rochester, the University of California, Los Angeles, and the Optical Applications Laboratory in France proposed the us...