Français

A US research team has developed a new type of photonic memory computing device

669
2024-10-24 11:36:03
Voir la traduction

Recently, a research team from the University of California, Santa Barbara has successfully developed a new type of photonic memory computing device that integrates non reciprocal magneto-optical technology. This device achieves high-speed, high-energy efficiency, and ultra-high durability photon computing by utilizing the non reciprocal phase shift phenomenon. The research findings, titled "Integrated non recurrent magneto optics with ultra high endurance for photonic in memory computing," were published in Nature Photonics.

Photon computing has become one of the important directions for the future development of artificial intelligence and machine learning due to its advantages of high speed and low energy consumption. However, the current photon processing architecture faces challenges such as slow storage array update speed, high energy consumption, and insufficient durability. The non reciprocal magneto-optical technology proposed by the research team has successfully solved these bottlenecks by integrating cerium doped yttrium iron garnet with silicon micro ring resonators. By utilizing the non reciprocal phase shift properties of this material, researchers have demonstrated fast programming (1 nanosecond), low energy consumption (143 femjoules per bit), and excellent durability (programmable 2.4 billion cycles) of photonic memory cells.

 


Figure a. Schematic diagram of computing architecture and unit devices; d. Schematic diagram of memory unit.


The core of this technology is to encode optical weights through the non reciprocal phase shift effect generated by magneto-optical materials in micro ring resonators. Unlike existing photon weights based on thermal or plasmonic dispersion effects, non reciprocal magneto-optical weights not only improve programming speed, but also significantly enhance the device's fatigue resistance and multi-level storage capability. The research team also pointed out that the photon computing platform using this new architecture is expected to provide higher computational efficiency for matrix vector multiplication (MVM) in artificial intelligence.

The photon memory unit demonstrated in this study can update weights at a very high programming speed with high-speed response and low energy consumption, greatly reducing the overall energy burden of the system. Especially in applications such as deep learning that require large-scale computing, this technology can significantly reduce the computational bottleneck of traditional electrical architectures through non-volatile, multi bit storage, further promoting the development of future computing architectures towards more efficient and green directions.

Based on the future development prospects of this technology, researchers believe that by further optimizing the integration of materials, such as utilizing spin orbit torque or spin torque transfer effects, it is possible to achieve higher switching efficiency. In addition, with the advancement of single-chip integration technology between cerium doped yttrium iron garnet and silicon photonic devices, this technology has enormous potential for future applications in fields such as photon computing and magnetic storage.

Source: Opticsky

Recommandations associées
  • The market accounts for up to 70%! Meere is continuously expanding its market layout

    According to Korean media reports, Meere, a semiconductor and display equipment manufacturer from South Korea, is continuously expanding its presence in the high stack semiconductor market, including its HBM business.In fact, Meere itself is the world's top manufacturer of display edge grinding mechanisms, with a market share of up to 70%. It is based on its accumulation of display microfabricatio...

    2024-06-25
    Voir la traduction
  • DIT and SK Hynix sign KRW 20.52 billion agreement

    Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. According to DIT, the equipment supplied to SK Hynix this time is mainly a laser annealing kit. DIT was founded in 2005 and was listed on KOSDAQ in 2018. Its main focus is o...

    01-20
    Voir la traduction
  • Electron beam welding process for thick steel plate of turbine at Aachen Institute of Technology in Germany

    Researchers from the Welding Research Institute of Aachen University of Technology in Germany reported on the development of a stable welding process for electron beam welding of thick plates used in the construction of offshore wind turbines. The relevant research results were published in Materials Science and Engineering Technology under the title "Development of a robust welding process for el...

    2024-07-09
    Voir la traduction
  • Shanghai Institute of Optics and Mechanics proposes a new scheme of Er doped silicate fiber as an extended L-band broadband amplifier

    Recently, Hu Lili, a research group of the Advanced Laser and Optoelectronic Functional Materials Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, proposed a new scheme based on field strength optimization of Er doped silicate fiber as an extended L-band broadband amplifier. Relevant research achievements were published in Optics Letters under the tit...

    2024-06-05
    Voir la traduction
  • FABULOUS provides certified food safety 3D printing materials to the United States

    As is well known, 3D printing is becoming increasingly popular and expanding its application areas to different fields. Additive manufacturing has been established in the aerospace, automotive, and medical industries and is now being used in the production of consumer goods and luxury goods, construction, and food industries. On the one hand, this mainly involves innovative edible products from 3D...

    2024-05-27
    Voir la traduction