chanelink logo
CHANELINK
Français

GOLDEN laser die-cutting machine will be exhibited at UPAKEXPO 2024

873
2024-01-12 14:07:34
Voir la traduction

At the UpakExpo 2024 exhibition to be held in Moscow at the end of January, Chinese company Golden Laser will showcase for the first time two laser die-cutting machines focused on the printing, labeling, and packaging markets in Russia.

The Golden Laser LC350 is a web machine designed to handle labels printed on digital and flexographic printing machines. It can cut, die cut, and kiss cut paper, plastic film, foil, composite materials, woven and non-woven materials, including transparent and reflective materials. The 350 millimeter wide model will be displayed on the booth, but the manufacturer also produces versions that allow you to use smaller and wider rolls.

The Golden Laser LC5035 is a B3 single sheet printer. It is suitable for small-scale production of die-cutting and slotting stickers, stickers, boxes, and components carved from various types and compositions of boards. The format of the exhibition copy is 80x60 centimeters, but other formats can be provided.

The Golden Laser equipment is designed specifically for the production of printing and packaging products and is represented by NISSA Centrum in Russia. Their experts will work at the Golden Laser booth. After the exhibition, the gold laser LC350 roll laser die-cutting machine will be relocated to the NISSA Centrum demonstration center in Moscow.

UpakExpo 2024 will be held from January 23rd to 26th at Exhibition Hall 8 of Expocentre Fairgrounds.

Source: Laser Net

Recommandations associées

  • Technology Frontiers | What is the Next Generation Laser?

    Since the 1960s, lasers have brought revolutionary changes to the world and have now become an indispensable tool in modern applications, from cutting-edge surgical procedures and precision manufacturing to fiber optic data transmission. However, with the increasing demand for laser applications, challenges have also arisen. For example, the market for fiber lasers is constantly expanding, mainly ...

    2024-06-21
    Voir la traduction

  • American scientists use light technology to control hypersonic jet engines

    According to the website "interesting engineering" on July 29th, a new study funded by the National Aeronautics and Space Administration (NASA) has revealed for the first time that the airflow in supersonic combustion jet engines can be controlled through optical sensors. This study was conducted by researchers from the School of Engineering and Applied Sciences at the University of Virginia.When ...

    2024-07-31
    Voir la traduction

  • Received NASA contract! Breakthrough blue light laser technology leads the space power revolution

    On May 6th, NUBURU, a leading enterprise in high-power and high brightness industrial blue laser technology, announced that the company has been awarded a second phase contract worth $850000 by the National Aeronautics and Space Administration (NASA) to promote blue laser power transmission technology as a unique solution that significantly reduces the size and weight of equipment required for lun...

    2024-05-08
    Voir la traduction

  • Patterned waveguide enhanced signal amplification within perovskite nanosheets

    Researchers at Busan National University, led by Kwangseuk Kyhm, Professor of Ultra Fast Quantum Optoelectronics from the Department of Optics and Mechatronics, are enhancing signal amplification inside cesium bromide lead perovskite nanosheets through patterned waveguides.Perovskite is a highly attractive material in solar cell applications, but its nanostructure is now being explored as a new la...

    2024-01-10
    Voir la traduction

  • Halo Industries raises 580 million yuan to achieve significant breakthrough in SiC laser processing field

    Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...

    2024-07-18
    Voir la traduction