Gigaphoton has delivered an excimer laser for advanced semiconductor packaging

A quasi molecular laser for advanced semiconductor packaging processes has been delivered by Gigaphoton to a Japanese advanced semiconductor R&D company and successfully installed in November 2025.

Gigaphoton has applied its expertise in semiconductor lithography lightsources to develop a lightsource for ultra-fine ablation processing for advanced packaging processes.

The G300K is an excimer laser based on KrF (248nm) wavelength, which is integrated into the processing equipment for semiconductor package substrates. It provides high power, high repetition rate, high reliability with long life modules.

The excimer laser is primarily used in the process of creating micro-via holes with a diameter of 10μm or less, as well as trench patterns. It is expected to be adopted for the manufacturing of 2.5D/3D packages utilizing chiplets, which are projected to increase and primarily used for AI chipsets.

Gigaphoton’s G300K has been integrated into the processing equipment manufactured by ORC Manufacturing. 

Tatsuo Enami, President and CEO of Gigaphoton said: "In Gigaphoton, alongside our research and development of lightsources for semiconductor lithography, we have also been exploring various possibilities for the application of excimer lasers in other fields.

"We will continue to accelerate our research and development efforts to expand into new areas. As a critical lightsource manufacturer in the semiconductor manufacturing industry, we will continue to contribute to the industry through continuous research and development on new processes to facilitate the further implementation of excimer lasers." 

Source: dqindia