- No hay datos
Español
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
On September 19th, Hongshan Laser made a stunning appearance at the Shanghai Industrial Expo with multiple flagship products. Among them, the "4+1" fully free heavy-duty groove laser pipe cutting machine TL730S, the 6G fully direct drive laser cutting machine G4020V, and the flagship drilling and attacking integrated laser composite pipe cutting machine TP65SD, represented by three new products, v...
BOFA has consolidated its position as a market leader in additive manufacturing of portable smoke and particle filtration systems with the latest generation of 3D PrintPRO technology designed specifically for high-temperature processes.3D PrintPRO HT focuses on the 230V market and can filter high-temperature particles, gases, and nanoparticles emitted during polymer processing in the printing room...
Recently, high-performance laser supplier Skylark Lasers announced that it has raised $5 million in investment to further advance its efforts in miniaturized laser technology.Skylark Lasers is established at the center of the Scottish Photonics Cluster, focusing on the design and production of compact diode pumped solid-state (C-DPSS) lasers with the purest spectral characteristics, providing high...
The British engineering and construction company Metz Group has a delegation in Spain to be responsible for the expansion and renovation of the central laser facility at Rutherford Appleton Laboratory near Oxford. More commonly, the construction of the powerful laser Vulcan 20-20 has just been obtained, with a delivery date of 2029.It will emit a main excitation beam that is billions of times larg...
In today's technology field, Juguang Technology released two highly anticipated high-power semiconductor lasers on December 13th: GS09 and GA03. These two products are leading the innovation wave in the laser industry with their miniaturized design, excellent thermal management capabilities, and extensive customization flexibility.GS09 revolutionizes chip spacing by compressing the width of the st...