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On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
Recently, Dong Yibo, from the Photonic Chip Research Institute of Shanghai University of Technology, published his research findings titled "Nanoprinted Diffractive Layer Integrated Vertical Cavity Surface Emitting Vortex Lasers with Scalable Topological Charge" as the first author in the internationally renowned journal Nano Letters.This achievement was jointly completed by the team of academicia...
Researchers have shown that dissipative Kerr solitons (DKS) can be used to create chip based optical frequency combs with sufficient output power for optical atomic clocks and other practical applications. This progress may lead to chip based instruments being able to perform precise measurements that were previously only possible in a few specialized laboratories.Gr é gory Moille from the ...
By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Imagine in such a world, the detection of trace substances is not only fast, but also incredibly accurate, indicating a new era of technological progress in health, safety, and environmental monitoring. Due to pioneering research on plasma waveguide structures, this vision is becoming increasingly realistic, aimed at enhancing refractive index sensing and spectral filtering. This innovative method...