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Hybrid 3D integrated optical transceiver. (A, B) Test setup: Place the photon chip (PIC) on the circuit board (green), and glue the electronic chip (EIC) onto the top of the photon chip. (C) It is the cross-section of the EIC-PIC component with micro protrusions. (D) Display the mesh of the finite element model.The latest progress in artificial intelligence, more specifically, is the pressure plac...
Last month, Manz AG officially announced that the company is about to undergo bankruptcy restructuring. The board of directors of the company believes that due to insufficient liquidity and excessive debt, Manz AG intends to apply for bankruptcy proceedings in accordance with bankruptcy laws. The application is expected to be submitted in the next few days. Manz AG is headquartered in Reutlingen...
The development of additive manufacturing (AM) has profoundly changed the manufacturing industry, and this technology has been applied in fields such as food, medicine, automotive, and electronic components. Especially in the aerospace field, where extremely lightweight and high-strength (~500mpa) components are required, aluminum alloy additive manufacturing is considered a very promising solutio...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
JILA researcher, National Institute of Standards and Technology (NIST) physicist, physics professor Adam Kaufman and his team at the University of Colorado Boulder, as well as NIST collaborators, demonstrated a new method of cross laser beam lattice sampling using ultracold atoms for boson sampling in two-dimensional optics. This study, recently published in the journal Nature, marks a significant...