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Recently, SMART Photonics, a Dutch photonic integrated circuit manufacturer, announced a major decision to transfer its entire production capacity from 3-inch wafers to 4-inch silicon substrates, thereby expanding the production scale of photonic chips and significantly reducing chip prices.According to the company, SMART Photonics is one of the first photonic integrated circuit foundries to provi...
Infinite Electronics brand and innovative operator level global supplier of fiber optic components, Integra Optics, announced the launch of its latest innovative product, the XGS-PON and GPON combination OLT SFP+BiDi optical transceiver module. This module integrates the passive optical network OLT and GPON OLT optical modules of XG (S), promoting seamless network rate deployment within the optica...
Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. According to DIT, the equipment supplied to SK Hynix this time is mainly a laser annealing kit. DIT was founded in 2005 and was listed on KOSDAQ in 2018. Its main focus is o...