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After electronic integrated circuits (Eics), silicon (Si) photonics technology is expected to achieve photonic integrated circuits (PIC) with high density, advanced functions and portability. Although various silicon photonics fountifiers are rapidly developing PIC capabilities to enable mass production of modulators, photodetectors and, more recently, lasers, silicon PIC has not yet met the strin...
Recently, Liang Xu's team from the Laser Center of Anguang Institute, Chinese Academy of Sciences, Hefei Institute of Materia Medica, conducted research on corona discharge fluid control and its application in the gas laser system, proposed an electric field flow field coupling analysis model suitable for multi pin corona discharge scenarios, and revealed the flow velocity distribution characteris...
Recently, EO Technologies, a well-known semiconductor laser processing equipment manufacturer in South Korea, is emerging in the glass substrate processing market.It is understood that EO Technologies is entering the glass substrate TGV market based on its UV laser drilling equipment originally used in PCB substrate technology. TGV technology is the core process for drilling holes inside glass sub...
3D printer manufacturer Raise3D has launched a new Fused Manufacturing (FFF) 3D printer series called Pro3 HS and a supercore filament series.The Pro3 HS series is equipped with a motion control system, which improves speed, accuracy, and simplifies the manufacturing of large composite components. Raise3D's Hyper Core filament has a dense fiber core and well arranged carbon fibers, which can enha...
The latest progress in X-ray laser technology has opened up a new era of nanoscale exploration, bringing unprecedented opportunities for materials science and nanotechnology. Researchers have developed a novel imaging technique that can directly visualize separated nanosamples in free flight, capturing their complex structures with stunning details. This breakthrough method relies on single cohere...