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Recently, HieFo, a leading enterprise in the field of optical communication, officially launched its HCL30 DFB laser chip, designed specifically to meet the stringent requirements of coherent optical transmission. This chip combines efficient optical output power with excellent narrow linewidth performance, providing multiple industry standard wavelength options in the O-band and C-band, bringin...
Tool has started pre-sales for the F1 Ultra, a 20 watt fiber and diode dual laser engraving machine. OEMs have stated that it is a win-win product and its so-called "flagship" model.Fiber lasers are mainly used for metal materials and usually work faster than diode lasers, but other materials have better performance when using diode lasers. F1 Ultra aims to bridge this gap by using a power of 20W ...
Recently, the research team of Dong Hongxing and Zhang Long from the Research Center of Infrared Optical Materials of the Chinese Academy of Sciences Shanghai Institute of Optics and Precision Mechanics, in cooperation with Huazhong University of Science and Technology, reported a new mechanism for generating dynamically tunable single-mode lasers from exciton polaritons with ultra-low thresholds,...
The National Key Laboratory of Interface Science and Technology for High end Equipment at Tsinghua University has made progress in the field of magnetic field and laser composite processing - magnetic field assisted laser shock strengthening of Ti6Al4V alloy. The relevant research was published as a cover article titled "Magnetic Field Assisted Laser Shock Peening of Ti6Al4V Alloy" in the journal ...
By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...