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The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....
backgroundThe Jörg Debus team from the Technical University of Dortmund in Germany is dedicated to researching optical quantum information processing and quantum sensing in materials with potential applications. The team mainly studies the fine structure of materials under light fields, such as quantum dots, quantum effects of two-dimensional materials, semiconductor defects in diamonds, and ...
Recently, the Xi'an Institute of Optics and Fine Mechanics of the Chinese Academy of Sciences has made significant progress in attosecond imaging research, achieving high-resolution imaging of ultra wide spectrum light sources. The related results were published in the journal Photonics Research under the title "Snapshot coherent diffraction imaging across ultra wideband spectra".Figure 1. Demonst...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
This collaboration deeply integrates the unique expertise and cutting-edge technological achievements of both companies in the field of optoelectronics, aiming to broaden the boundaries of optoelectronics innovation.EPIGAP OSA Photonics GmbH, as a leader in the research and manufacturing of optoelectronic components in Germany, is deeply rooted in multiple fields such as medical technology, indust...