Tescan expands semiconductor workflow using femtosecond laser technology

Tescan releases its next-generation femtosecond laser platform, FemtoChisel, expanding its semiconductor product portfolio. This platform is committed to improving the speed, accuracy, and quality of sample preparation, and will officially debut at the ISTFA exhibition in 2025.

FemtoChisel was developed specifically for semiconductor research and failure analysis environments where both throughput and adaptability are critical. By combining nanometer-level precision and high-throughput intelligent laser processing, FemtoChisel delivers pristine surfaces while significantly reducing the need for subsequent FIB polishing steps. This enables faster turnaround in research and failure analysis for current, and future, semiconductor materials.

“Semiconductor research and failure analysis teams are under constant pressure to deliver faster, more reliable results from any material layer within semiconductors stack. With FemtoChisel, we’ve addressed this challenge in our Large Volume Workflow for Semiconductors,” said Sirine Assaf, Chief Revenue Officer at Tescan. “It’s not just a new instrument – it’s a workflow enabler. By integrating ultrafast, femtosecond laser precision with intelligent adaptive laser processing, we’re helping labs accelerate sample preparation, reduce rework, and bring clarity to increasingly more complex devices.”

Workflow Benefits of FemtoChisel
Adaptive multi-material processing, High Fluence Laser Machining with proprietary intelligent multi-gas processing and laser protective layer that preserves device integrity across metals, polymers, and advanced packaging stacks.
High-throughput access to buried structures with taper-corrected, debris-free cross-sections – often eliminating the need for FIB finepolishing.
Selective backside thinning with mirror-like surfaces (Ra < 0.4 µm), enabling optical fault analysis without artifacts.
Large-area delayering (> 5 mm) with automated endpointing for accurate layer-by-layer removal at laser speeds.
By uniting laser processing, electron microscopy, and FIB into complementary workflows, Tescan is helping semiconductor innovators overcome traditional bottlenecks in sample preparation. FemtoChisel serves both recipe-driven environments and flexible research in advanced packaging and R&D labs, providing a versatile solution for current and future semiconductor demands.

Tescan’s commitment to integrated workflows is further strengthened by its Laser Technology Business Unit, established following the acquisition of FemtoInnovations. This dedicated focus ensures continued innovation in laser-enabled sample preparation technologies for the semiconductor industry.

Source: AZOM