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EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Silicon Austria Labs, a leading electronic systems research center in Austria, announced that SAL has received and installed multiple EVG lithography and photoresist processing systems in its MicroFab at the R&D cleanroom facility in Filach, Austria.These devices...
Recently, Li Hao and You Lixing's team from the Chinese Academy of Sciences Shanghai Institute of Microsystems and Information Technology developed an ultrahigh speed, photon number resolvable optical quantum detector with a maximum count rate of 5GHz and a photon number resolution of 61 by using the sandwich structure superconducting nanowires and multi wires working in parallel. The related rese...
Zygo Corporation, a business unit of AMETEK, announced that it will be showcased at the D28 booth of the Space Comm Expo held in Farnborough, UK from March 6th to 7th this year.Space Comm showcases the end-to-end supply chain of products, services, and applications that provide information and technological development for commercial aerospace enterprises, governments, and defense organizations, p...
A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.With the advent of integrated c...
Farnell stated that it will store a series of 3D printed filaments under its Multicomp Pro brand, targeting "design engineers, creators, and hobbyists."."With the growing interest and demand for 3D printing, we are pleased to provide our customers with a diverse range of 3D printer consumables aimed at meeting the quality standards required by engineers," added Steve Jagger Marsh, the company's pr...