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Van's Aircraft has responded to reports of ruptured dented parts found in AirVenture's latest kit. These defects are caused by external suppliers changing the process of laser cutting parts. From February 2022 to June 2023, Van's moved some parts from traditional punch manufacturing to an outside supplier that can laser cut rivet holes. The move is designed to increase the company's throughput and...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
Recently, researchers and their partners from the Fraunhofer Institute for Reliability and Microstructure (IZM) in Germany announced the successful development of a laser welding technology that can efficiently fix optical fibers onto photonic integrated circuits (PICs) without the need for adhesive bonding.This technology is developed in response to biophoton sensing technology, mainly utilizing ...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. After the announcement, DIT's stock price rose for five consecutive days, entering the 16000 Korean won range. Then on the 22nd, it rose 2580 Korean won from the previous day'...
A sketch of the imaging and holographic parts of a transient holographic microscope, including a pulse sequence, to illustrate the signal modulation method. By imaging the pinhole array at the sample position, a diffraction limited excitation spot array can be created, allowing for the simultaneous collection of transient data around 100 excitation spots.Femtosecond transient microscopy is an impo...