Deutsch

Three core processes of laser soldering support the development of PCB electronics industry

516
2024-04-15 16:43:52
Übersetzung anzeigen

In the field of modern electronic manufacturing, PCB (printed circuit board) serves as the carrier of electronic components. In its manufacturing process, laser soldering technology has become a key link in PCB electronic manufacturing due to its advantages of high precision, high efficiency, and low thermal impact. This article will explore the application of laser soldering technology and its main soldering materials - tin wire, solder paste, and solder balls - in PCB electronic manufacturing.

01
Laser Tin Wire Welding for PCB Circuit Board Welding
Tin wire plays an important role in laser soldering process. After focusing the laser beam, it can quickly melt the tin wire, achieving reliable connection between components and PCB boards. This welding method not only reduces the thermal stress generated during the welding process, but also effectively improves the welding quality and reduces the welding defect rate.
Laser tin wire welding has the advantages of high precision and high efficiency, and is suitable for situations with high requirements for welding quality. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved.

02
Laser solder paste welding for PCB circuit board welding
Solder paste is mainly used for soldering surface mount components. After coating an appropriate amount of solder paste on the PCB board, the components are heated by a laser soldering machine to melt the solder paste and penetrate into the gap between the components and the PCB board, forming a solid solder joint.
Solder paste welding has the characteristics of simple operation and fast welding speed, making it suitable for efficient welding on large-scale production lines. In addition, solder paste welding can also reduce production costs and improve welding quality.

03
Laser solder ball welding for PCB circuit board welding
Tin balls, as a new type of soldering material, have received widespread attention in the field of laser soldering in recent years. The laser beam quickly melts the solder balls and accurately drips them onto the solder joints, achieving the welding between the components and the PCB board.
Tin ball welding has the advantages of high welding accuracy and low heat impact, making it particularly suitable for high-end electronic products that require high welding quality, such as BGA chips, wafers, hard disk heads, camera modules, and optoelectronic products.

04
The Future Development of Laser Soldering Technology
In the field of PCB electronic manufacturing, the emergence of laser soldering technology, combined with perfect soldering materials such as tin wire, solder paste, and solder balls, has brought revolutionary changes to the entire electronics industry and injected a continuous stream of vitality. In the future, with the continuous development of technology, we believe that laser soldering technology will play a more important role in the electronics industry, bringing more convenience and surprises to our lives.

05
The advantages of laser soldering technology
The perfect combination of laser soldering technology and various soldering materials further improves the welding quality. Not only has it subverted traditional soldering methods, but it has also significantly reduced production costs and defect rates while improving welding efficiency and quality, laying a solid foundation for the sustainable development of the electronic manufacturing industry.

Soldering materials such as tin wire, solder paste, and solder balls, under the action of laser, can not only quickly melt and achieve perfect fusion with the parts to be welded, ensuring the strength and stability of the welded joint, but also avoiding adverse phenomena such as virtual soldering and cold soldering that may occur in traditional soldering. The high-speed characteristics of laser welding significantly improve production efficiency, providing strong support for the large-scale production of electronic products.

In addition, laser soldering technology also has high flexibility. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved. This flexibility makes laser soldering technology more widely used in the field of PCB electronics, meeting the needs of different customers.

Source: Zichen Laser

Ähnliche Empfehlungen
  • Smaller laser facilities use new methods to break records before proton acceleration

    The Helmholtz Dresden Rosendorf Center (HZDR) has made significant progress in laser plasma acceleration. By adopting innovative methods, the research team successfully surpassed previous proton acceleration records significantly.They obtained energy for the first time that can only be achieved in larger facilities so far. As reported by the research team in the journal Nature Physics, promising a...

    2024-05-15
    Übersetzung anzeigen
  • BenQ Launches V5000i 4K RGB Laser TV Projector

    Display solution brand BenQ recently launched the 4K RGB laser TV projector V5000i.The V5000i focuses on providing the pinnacle of innovation, unparalleled color accuracy, and excellent audio quality, elevating the home theater world to unprecedented heights. It is the perfect replacement for large screen televisions, particularly suitable for well lit spaces such as spacious living areas, "the co...

    2023-10-10
    Übersetzung anzeigen
  • Improved spectrometer color filter array for software calibration without the need for laser

    Hackaday will launch cool projects that may stimulate others to expand and enhance it, and even move in a completely new direction. This is the way the most advanced technology continues to evolve. This DIY spectrometer project is a great example of this spirit. It comes from Michael Prathofer, who was inspired by Les Wright's PySpectrometer, a simple device pieced together by a pocket spectrom...

    2024-05-28
    Übersetzung anzeigen
  • GOLDEN laser die-cutting machine will be exhibited at UPAKEXPO 2024

    At the UpakExpo 2024 exhibition to be held in Moscow at the end of January, Chinese company Golden Laser will showcase for the first time two laser die-cutting machines focused on the printing, labeling, and packaging markets in Russia.The Golden Laser LC350 is a web machine designed to handle labels printed on digital and flexographic printing machines. It can cut, die cut, and kiss cut paper, pl...

    2024-01-12
    Übersetzung anzeigen
  • Shanghai Institute of Optics and Mechanics has made progress in studying the structure and properties of aluminum phosphate glass

    Recently, Hu Lili, a research team of the High Power Laser Unit Technology Laboratory of the Chinese Academy of Sciences Shanghai Institute of Optics and Fine Mechanics, used a method combining experiment, molecular dynamics simulation and quantitative structure property relationship analysis (QSPR) to study aluminum phosphate glass, and the related research results were published in the Journal o...

    2023-09-15
    Übersetzung anzeigen