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The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....
By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Recently, a research team from the Korea Institute of Industrial Technology and POSTECH University successfully utilized laser sintering pattern technology to create a deformable micro supercapacitor (MSCs), specifically designed to provide energy storage solutions for soft electronic devices. This breakthrough meets the urgent need for efficient energy storage systems in stretchable devices in...
As one of the important means of transportation in modern society, the safety and performance of aircraft have always been the focus of attention. Behind the continuous pursuit of technological breakthroughs in the aviation industry, carbon fiber materials, as a lightweight and high-strength material, are gradually emerging in the application of aircraft fuselage.Combined with the application of ...
Tesat Spacecom's laser communication terminal announced on October 26th that the company has passed critical ground testing deployed on NASA satellites.Tesat's SCOTT80 optical terminal was selected by Lockheed Martin, one of several manufacturers producing satellites for the Space Development Agency.SDA is an agency under the United States Space Force that plans to deploy a network of interconnect...