- Keine Daten
Deutsch
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Recently, the research team of Chang Lin from the School of Electronics of Peking University and the research team of Li Wangzhe from the Aerospace Information Research Institute of the Chinese Academy of Sciences published a research article entitled "Microcomb synchronized optoelectronics" online in Nature Electronics, realizing the application of photonic chip clocks in information systems for ...
Researchers from the Federal Institute of Technology in Zurich and an American startup used slow curing plastic to develop durable and sturdy robots using high-quality materials.The team can now print these complex robots at once and combine soft, elastic, and rigid materials together. This allows for the creation of precision structures and parts with cavities as needed.Inkbit, a derivative compa...
TDK Corporation (TSE: 6762) announced the introduction of the new NTCWS series of NTC thermistors with gold wire bonding. These bonding NTC thermistors can be installed in packages via gold wire bonding to enable high precision temperature detection of laser diodes (LD) for optical communication. The series will begin mass production in September 2023.The use of LD devices in optical communication...
On February 11th, global industrial fiber laser giant IPG Photonics announced its financial performance for the fourth quarter and full year of 2024. Annual sales have fallen below the $1 billion mark for the first time, with a year-on-year decline of 24% and a pre tax loss of up to $162 million. As an industry leader, IPG's financial report not only reflects the deep adjustment faced by the ind...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...