- Keine Daten
Deutsch
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
At the recently concluded 2024 International Consumer Electronics Show (CES), automotive related technologies and solutions shone brightly, and a group of Chinese LiDAR suppliers competed on the same stage.The technologically advanced products, systematic solutions, continuously increasing delivery and market retention have to some extent proven that in the context of the development of automotive...
Laser gas analysis can achieve high sensitivity and selectivity in gas detection. The multi-component capability and wide dynamic range of this detection method help analyze gas mixtures with a wide concentration range. Due to the fact that this method does not require sample preparation or pre concentration, it is easy to adopt in the laboratory or industry.Gas analysis is crucial for determining...
In the process of selecting electric vehicles, the effectiveness of the heating system is often overlooked. However, this system is crucial for providing a warm and comfortable driving environment and removing frost and fog from winter windows. More importantly, it can also improve battery efficiency, as the battery performs best within a specific temperature range.Unlike internal combustion engin...
They are the strongest lasers in history, and their beams are helping scientists explore the structure of the universe.In a research laboratory at the University of Michigan, bright green light fills the vacuum chamber of a technology giant. It is the size of two tennis courts. The walls are shielded with 60 centimeters of concrete to prevent radiation leakage, and workers wear masks and hairnets ...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...